ISSTA 2017 Workshops
26th ACM SIGSOFT International Symposium on Software Testing and Analysis (ISSTA 2017)
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1st ACM SIGSOFT International Workshop on Testing Embedded and Cyber-Physical Systems (TECPS 2017), July 13, 2017, Santa Barbara, CA, USA

TECPS 2017 – Proceedings

 Contents - Abstracts - Authors

1st ACM SIGSOFT International Workshop on Testing Embedded and Cyber-Physical Systems (TECPS 2017)

Frontmatter

Title Page
Message from the Organizers

Papers

Discovering Instructions for Robust Binary-Level Coverage Criteria
Vaibhav Sharma, Taejoon Byun, Stephen McCamant, Sanjai Rayadurgam, and Mats P. E. Heimdahl
(University of Minnesota, USA)
Testing Uncertainty of Cyber-Physical Systems in IoT Cloud Infrastructures: Combining Model-Driven Engineering and Elastic Execution
Hong-Linh Truong and Luca Berardinelli
(Vienna University of Technology, Austria)
Fault Injection in the Internet of Things Applications
Mohammad Amin Alipour
(University of Houston, USA)
Towards Automated Composition of Heterogeneous Tests for Cyber-Physical Systems
Alex Groce, Paul Flikkema, and Josie Holmes
(Northern Arizona University, USA; Pennsylvania State University, USA)

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